AMC > Semiconductor tape > Type of semiconductor tape > Die Attach Tape(DAF Tape, WBL)

Types of Die Attach Tape(DAF Tape, WBL)

- Wafer Dicing and bonding

- UV curing type

- Thermal curing type, high adhesive strength

- Expandable type

Item DAF
Thickness
Tg(℃) Elastic Modulus
(Mpa) @250oC
Peel Adhesion
(gf/25) Between
A/F & D/F
Characteristics
AWD4 5㎛ 188 30 - DAF layer only
AWD9 25㎛ 121 49 - Wafer backside Coating Tape
AWU120 20㎛ 210 6 100 Normal Process
ES-229N 10,20,30㎛ 210 6 70 DBGprocess, Mold Void Free
ES-229NS 10,20,30㎛ 203 214 80 Small size chip (under 2㎟)
*.() Refers to adhesive strength after UV
Note 1)Test Method : JIS Z 0237 / KS A 1107

Note 2)The Product could be modified by customer’s request