After the wafer was finished by polishing and other process, the die on the wafer has to be sawn in each chip. In this application, P.S.A tape has to be used to prevent the chip-fly and help pick-up easily. There are 2 kinds of PSA tapes such as NON-UV Tape and UV curable tape. Especially, wafer has got bigger, thinner and higher integrated the chip. So, the UV curable adhesive tape becomes essential in sawing application. Compared to Non-UV Tape, the UV curable adhesive tape has strong adhesion before UV irradiation to prevent the chip flying.
After UV irradiation, it has much lower adhesion. Therefore, the UV curable adhesive Tape helps chip pick-up easily and Tape prevents the chip from damaging such as micro crack. As a result, it’s very useful and functional tape.