| Forming the Pattern on the wafer |
After the light exposure on the photomask, the pattern is printed and developed on the wafer. |
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| Etching |
Etching the oxidation layer on the wafer partially, you make I.C |
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| I.C. Completion |
After about 300-400 process, finally I.C. can be completed on the wafer. |
| Back Grind |
Laminating the Tape for protecting the surface of wafer
Before grinding the wafer face, laminate the protective tape to prevent foreign material from penetrating. |
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Grinding the Wafer Surface
To thin the wafer, it grinds the back side of the wafer by suitable thickness |
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Removing the protective tape
You remove the protective tape laminated to protect the surface.
* In case of UV tape, remove it after UV irradiation. |
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| Dicing |
Laminating the Tape
In dicing the wafer, the tape is laminated on the frame and wafer to prevent chips from flying. |
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Dicing
The wafer is diced for suitable chip size. |
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Pick up
The sawn-chip on the wafer is picked up.
* In case of UV tape, after UV irradiation the chip is picked up. |
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Being Package
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After die bonding, the chip is to be package. |
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Package Dicing
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Tape Laminate
In package dicing, the tape is laminated on the dicing frame and package to prevent chips from flying. |
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Dicing
Each package is sawn for suitable size. |
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Pick up
The sawn package is picked up.
* In case of UV tape, the package is picked up after UV irradiation.
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Completion the IC package
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After inspection and reliability test, the package is completed. |
