AMC > 반도체 Tape > 제품리스트 > Back Grind Adhesive tape

Back Grind Adhesive tape의 종류

- Wafer Back Grinding tape
- Improving TTV Value
- Prevent Dust and Wafer Penetration
- Absorbing Mechanical stress

Item Thickness Adhesive Strength
(gf/25mm)		 Base film / Characteristics
ABP1 130㎛ 100 PO / Nomal wafer BackGrinding
APB3 150㎛ 150 PO / Small size chip (under 2㎟)
APB5 90㎛ 110 PET / Excellent Total Thickness Variation
AP205 205㎛ 150 PO / Small size chip (under 2㎟)
AU130-SC 130㎛ 330(30) PO / Normal wafer BackGrinding
AUB4 130㎛ 1,000(20) PO / Small size chip (under 2㎟)
AUDBG 125㎛ 1,200(6) PET / SDBG process
AU200-SD 200㎛ 1,900(30) PET / Flip Chip (Cu-pillar type Bump)
AU340-HB 340㎛ 1,700(20) PO / Flip Chip (Solder Ball type Bump)
*.() Refers to adhesive strength after UV
Note 1)Test Method : JIS Z 0237 / KS A 1107

Note 2)The Product could be modified by customer’s request