AMC > 반도체 Tape > 제품리스트 > Back Grind Adhesive tape

Back Grind Adhesive tape의 종류

– Wafer Back Grinding tape
– Improving TTV Value
– Prevent Dust and Wafer Penetration
– Absorbing Mechanical stress

Model Name APB1 AU130-SC AUB4
Structure Base Film Polyolefin Polyolefin Polyolefin
Adhesive Acryl Acryl Acryl
Thickness(㎛) Total Base film 130 110 130 110 130 110
Adhesive 20 20 20
Protection Film 38 38 38
Physical property Tensile Strength (N/mm2) 20 20 20
Elongation (%) 800 900 800
Adhesion (gf/25㎜) Before UV irradiation 100 330 850
After UV irradiation   30 10
Application Non-UV Type UV Type UV Type
Note 1)Test Method : JIS Z 0237 / KS A 1107
Note 2)The Product could be modified by customer’s request