AMC > 반도체 Tape > 제품리스트 > Dicing Adhesive tape

Dicing Adhesive tape의 종류

– Wafer Dicing tape
– UV or Non-UV curing type
– Improved back side chipping, contamination
– Expandable type

Model Name AUD1 AUD4 AUF3 AU105-HA
Structure Base Film PVC PVC Polyolefin Polyolefin
Adhesive Acryl Acryl Acryl Acryl
Thickness(㎛) Total Base film 90 80 90 80 90 80 105 100
Adhesive 10 10 10 5
Protection Film 38 38 38 38
Physical property Tensile Strength (N/mm2) 30 30 26 20
Elongation (%) 400 370 900 800
Adhesion (gf/25㎜) Before UV irradiation 80 155 1000 500
After UV irradiation 10 7 8 10
Application Expandable Expandable Expandable Expandable
Note 1)Test Method : JIS Z 0237 / KS A 1107
Note 2)The Product could be modified by customer’s request