AMC > 반도체 Tape > 제품리스트 > Dicing Adhesive tape

Dicing Adhesive tape의 종류

- Wafer Dicing tape
- UV or Non-UV curing type
- Improved back side chipping, contamination
- Expandable type

Item Thickness Adhesive Strength
(gf/25mm)
Basefilm / Characteristics
AUD1 90㎛ 80(10) PVC / Nomal wafer Sawing
AUD5G 90㎛ 80(7) PVC / CIS (CMOS image sensor)
AUD7 90㎛ 120(13) PVC / Small size chip (under 2㎟)
AUD8 90㎛ 200(8) PVC / Small size chip (under 2㎟)
AUF3 90㎛ 1,000(8) PO / PCB Sawing
AU105-HA 105㎛ 550(12) PO / Wafer Sawing, Glass protect
ADP3 85㎛ 110 PO / No change in adhesion over time
*.() Refers to adhesive strength after UV
Note 1)Test Method : JIS Z 0237 / KS A 1107Note 2)The Product could be modified by customer’s request