AMC > 반도체 Tape > 제품리스트 > Package Dicing Adhesive tape

Package Dicing Adhesive tape의 종류

- Package Dicing tape
- UV curing type
- Improved back side chipping, contamination by water
- Higher Adhesive tape for Package Dicing Application

Item Thickness Adhesive Strength
(gf/25mm)
Basefilm / Characteristics
AU115-HC 115㎛ 1400(27) PO / Small PKG sawing
AU165-HC 165㎛ 1900(30) PO / Small PKG sawing
AU170-HC 170㎛ 1800(30) PO / Normal PKG sawing
AUP1 175㎛ 2200(40) PO / Power QFN Package
AUP4 170㎛ 1900(30) PO / No odor after UV, Small PKG sawing
AUP8 170㎛ 900(13) PO / Anti-static, Small PKG sawing
AUG2 150㎛ 1800(10) PET / Glass sawing
AUG4 125㎛ 3800(10) PET / Glass sawing
AUG5 125㎛ 1900(10) PO / Glass sawing
*.() Refers to adhesive strength after UV
Note 1)Test Method : JIS Z 0237 / KS A 1107Note 2)The Product could be modified by customer’s request