AMC > 반도체 Tape > 제품리스트 > Die Attach tape(DAF Tape,WBL)

Die Attach Tape(DAF Tape, WBL)의 종류

- Wafer Dicing and bonding
- UV curing type
- Thermal curing type, high adhesive strength
- Expandable type

Item DAF
Thickness
Tg(℃) Elastic Modulus
(Mpa) @250oC
Peel Adhesion
(gf/25) Between
A/F & D/F
Characteristics
AWD4 5㎛ 188 30 - DAF layer only
AWD9 25㎛ 121 49 - Wafer backside Coating Tape
AWU120 20㎛ 210 6 100 Normal Process
ES-229N 10,20,30㎛ 210 6 70 DBGprocess, Mold Void Free
ES-229NS 10,20,30㎛ 203 214 80 Small size chip (under 2㎟)
*.() Refers to adhesive strength after UV
Note 1)Test Method : JIS Z 0237 / KS A 1107Note 2)The Product could be modified by customer’s request